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HANMI SEMICONDUCTOR|back-end test equipment
Mechanical Molding Press
Trim CAM Press
Form CAM Press
Auto Mold System
Manual Mold System
Laser Marking - Strip
JOHNSTECH | test sockets
High-Performance Test Sockets for production and characterization testing at DC to 40GHz. Package types include QFN, QFP, SOIC, TSSOP, etc. Center Body Grounding, Lead-Free Solutions, Manual and Automated Handler Test, Easy to maintain, High throughput, Superior Contact Resistance.
SEMICAPS | photon emission & laser scanning microscopes
Photon Emission Microscopes (PEM), Laser Scanning Microscopes (LSM), PEM, OBIC, SCOBIC, TIVA, LIVA, OBRICH SEI and other advanced failure analysis test methods. Optical Digital Imaging systems for SEM, TEM, Augers, and FIB.
SIGNATONE | probe stations
Probe Stations, Micro Positioners, Micro Probes, Probe tips, Hot & Cold Chucks, Thermal Chucks, Resistivity Four Point Probes, Dark Boxes, Light Tight Enclosures, UV, Green and Infrared Cutting Lasers, Vibration Tables
SUMICARRIER | carrier tape, cover tape, plastic reels
PVC Cover Tape, PET Cover Tape, PC Cover Tape, PS Cover Tape, Carrier Tape, Plastic Shipping Reels.
SUMITOMO | lead frames, substrates
Etched and Stamped Lead Frames, QFN & BCC, Taped BGA, Taped CSP, Multiple plating options, Multi-Strand Production Capability.
WEB TECHNOLOGY | back-end equipment
Gross Leak Testers (Bubble Testers), Gross and Fine Leak Preconditioning, Centrifuges and Centrifuge Fixtures, Component Testers, Automated Burn-In Board Loaders, Test Handlers, Custom Design Solutions
NIPPON | solder balls, solder paste
Advanced Lead Free Solder Balls, that are void less, oxidation free, smooth surface. We also offer Advanced Raw Solder Paste also void less and oxidation free. Solder applications include Flip Chip, Bumped Wafers, PCB, Solder Plated Lead Frames, etc.
SELA | SEM, TEM, STEM sample preparation
Leader in SEM, TEM ad STEM sample preparation, eliminating conventional (manual) sample preparation that is imprecise & involves many time consuming steps, and high maintenance. SELA automated sample prep tools reduce sample preparation processing times from hours to less than ten minutes. Lower cost of ownership. Pristine surface not effected by the artifacts reminant of a typical of polishing process.
NIPPON
Joint
Conventional
Solder
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MECHANICAL DEVICES | temperature controllers
Wide range of products as well as custom design to meet all your required heat dissipation needs. Providing fully integrated solutions specializing in thermal, mechanical and electronic packaging.
Nippon
Solder
GE-PHOENIX X-RAY | real time x-ray
2D X-Ray, 3D Computed Tomography X-Ray inspection of BGA, CSP, QFP, QFN, Voiding Calculation, Wire Sweep, Printed Circuit Boards, and other applications.
CAMTEK | automated optical inspection
Advanced AOI systems for silicon wafers, MEMs, TSV, PCB, PBGA, CSP, Substrates for solder & gold bump inspect, post-diced inspect, probe mark defects, wafer scratches, debri, contamination, deposition defects, CMP, photo etch, wafer edge inspection, discoloration, shape violation, high-speed macro inspection.
RENESAS | die bonders & wafer sorters
Wafer Sorter, Wafer Chuck, SiP Bonder, SiP Mounter, High Sensitivity Gas Analyser. Flexible Die Bonders for SiP assembly with 300mm wafer handling capability. Patented “Wafer Pick” design for high-speed, thin wafers down to 50 microns without breakage. Wafer Sorters for 300mm wafer applicable to clean carrier, wafer-by-wafer control, and full automatic carrier system.
Universal Saw & Pick Place
PBGA Singulation
Stand-alone Strip Test System
Solder Ball Attach System
Tape & Reel System
